0571-26692003
No. 181 Geyazhuang, Xihu District,Hangzhou, Zhejiang, P.R. China
The project has overcome the challenge of poor thermal stability in traditional packaging materials by developing novel high-temperature-resistant alternatives. These innovations enhance device power density and enable product miniaturization and weight reduction.
1. Power devices
The novel packaging materials can withstand high energy density, and can are suitable for high-temperature power modules, supporting product weight reduction and miniaturization.
2. Automotive low-voltage modules
High-temperature-resistant and highly reliable epoxy resins can be applied to automotive modules, enhancing their power density.
3. Consumer electronics
Thermally conductive potting compounds reduce poisoning phenomena and can be widely used in consumer electronics modules, power supplies, sensors, and other applications.
1. High-temperature resistant organic two-component silicone gels, potting epoxy resins, and similar materials
Offers excellent thermal stability, solving the issue of device failure caused by hardening or cracking of traditional materials during high-temperature aging processes.
2. Nano-silver sintering paste
Achieves low-temperature bonding with excellent conductivity and reliability.
